A Novel Hybrid Photonic Integration Scheme Based on Flip-Chip Bonding Combined With Vertical Coupling
A hybrid photonic integration scheme based on flip-chip bonding combined with vertical coupling is presented in this work, offering a novel solution for the integration of active and passive chips.An offset quantum-well laser is flipped and bonded into the pre-set cavity of the passive chip.The light emitted from the emtek 2113 laser propagates thr